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 HD151012
8-bit Binary Programmable Counter with Synchronous Preset Enable
REJ03D0299-0200Z (Previous ADE-205-132 (Z)) Preliminary Rev.2.00 Jul.16.2004
Description
The HD151012 has 8-bit binary down counter and D-type Flip Flop. The counter can set up to max 256 counts and synchronous preset (SPE) input can preset the data. When the count value is 0, the next clock pulse presets the data to invert the output. D-type Flip Flop takes the counter output as clock pulse, whose data is transferred to output at the rise edge. It is applied to generate AC signal for STN type liquid crystal and general-use divider.
Features
* High speed operation tpd (CLK or CLK to Q) = 35 ns (typ) * High output current Fanout of 10 LS TTL Loads * Wide operating voltage VCC = 2 to 6 V * Low supply current (Ta = 25C) ICC (Static) = 4 A (max) * Ordering Information
Part Name HD151012TELL Package Type TSSOP-16 pin Package Code TTP-16DAV T Package Abbreviation Taping Abbreviation (Quantity) ELL (2,000 pcs/reel)
Function Table
Control Inputs CLR H X L H H X H L PR H L -- -- SPE Mode Generally count Synchronous preset Initialize of Q output Initialize of Q output Operation Description Down count at the rise edge of clock (CLK) Down count at the fall edge of clock (CLK) Jn data is preset at the rise of clock (CLK), the fall of clock (CLK) Initialize of Q = "L" Initialize of Q = "H"
Notes: 1. Synchronous preset (SPE) input can set max 256 down counts. 2. When the count value is 0, the next clock pulse presets the data to invert the output. 3. CLR and PR inputs initialize output state. H : High level L : Low level X : Immaterial -- : Irrespective of condition
Rev.2.00, Jul.16.2004, page 1 of 13
HD151012
Pin Arrangement
J0 1 J1 2 J2 3 J3 4 J4 5 J5 6 J6 7 GND 8
16 VCC 15 CLK 14 CLK 13 Q 12 PR 11 SPE 10 CLR 9 J7
(Top view)
Pin Description
Pin Name Input pins J0 to J7 CLK, CLK SPE PR Output pins CLR Q Pin Description Count data input for option Clock inputs CLK : Rise edge trigger CLK : Fall edge trigger Preset input for Jn data Preset input for D-type Flip Flop (Initialize "L" at Q output) Clear input for D-type Flip Flop (Initialize "H" at Q output) Output for D-type Flip Flop
Absolute Maximum Ratings
Item Supply voltage Input / output voltage VCC, GND current Output current / pin Power dissipation Storage temperature Input diode current VCC VIN/VOUT ICC, IGND IOUT PT Tstg IIK Symbol Ratings -0.5 to 7.0 -0.5 to VCC +0.5 50 25 500 -65 to 150 20 Unit V V mA mA mW C mA
Output diode current IOK 20 mA Notes: 1. The absolute maximum ratings are values which must not individually be exceeded, and furthermore, no two of which may be realized at the same time. 2. All voltage values except for differential input voltage are with respect to network ground terminal.
Rev.2.00, Jul.16.2004, page 2 of 13
HD151012
Recommended Operating Conditions
Item Supply voltage Input/output voltage Operating temperature Input rise/fall time*1 VCC = 2.5 V VCC = 4.5 V VCC = 5.5 V Note: Symbol VCC VIN/OUT Topr tr, tf 2 0 -40 0 0 0 Min -- -- -- -- -- -- Typ 6 VCC +85 1000 500 400 Max V V C ns Unit
1. This item guarantees maximum limit when one input switches.
Logic Diagram
J0 J1 J2 J3 J4 J5 J6 J7 J0
8-bit binary counter
CLK CLK CLK
J1 J2 J3 J4 J5 J6 J7
PR PR D CO SPE CK CLR SPE CLR Q Q Q
Rev.2.00, Jul.16.2004, page 3 of 13
HD151012
Electrical Characteristics
Ta = 25C Item High level input voltage Ta = -40 to 85C Test Conditions
Symbol VCC Min Typ Max Min Max Unit VIH 2.0 1.5 -- -- 1.5 -- V J0 to J7 4.5 6.0 2.0 4.5 3.15 4.2 1.5 3.15 4.2 -- -- -- -- -- -- 1.9 4.4 5.9 4.18 5.68 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 2.0 4.5 6.0 4.31 5.80 0.0 0.0 0.0 0.17 0.18 -- -- -- -- -- -- -- 0.5 1.35 1.8 0.5 1.35 1.8 -- -- -- -- -- 0.1 0.1 0.1 0.26 0.26 0.1 4.0 3.15 4.2 1.5 3.15 4.2 -- -- -- -- -- -- 1.9 4.4 5.9 4.13 5.63 -- -- -- -- -- -- -- -- -- -- -- -- 0.5 1.35 1.8 0.5 1.35 1.8 -- -- -- -- -- 0.1 0.1 0.1 0.33 0.33 1.0 40.0 mA mA V VIN = VIH or VIL V V SPE PR, CLR CLK, CLK
Low level input voltage
VIL
6.0 2.0 4.5 6.0 2.0 4.5
J0 to J7 SPE PR, CLR CLK, CLK
High level output voltage
VOH
6.0 2.0 4.5 6.0 4.5 6.0
VIN = VIH or VIL
IOH = -20 mA
IOH = -4 mA IOH = -5.2 mA IOL = 20 mA
Low level output voltage
VOL
2.0 4.5 6.0 4.5
IOL = 4 mA IOL = 5.2 mA VIN = VCC or GND VIN = VCC or GND
Input capacitance Supply current
IIN ICC
6.0 6.0 6.0
Rev.2.00, Jul.16.2004, page 4 of 13
HD151012
Switching Characteristics (CL = 50 pF, tr = tf = 6 ns)
SymItem Maximum clock frequency Output rise/fall time tTLH tTHL tPLH tPHL tPLH tPHL Pulse width (CLK, CLK, PR, CLR) Setup time (Jn - CLK, CLK) (SPE, CLK, CLK) Hold time (Jn - CLK, CLK) (SPE, CLK, CLK) Input capacitance Power dissipation capacitance*1 Note: CIN CPD ts tw bol fmax Ta = 25C Ta = -40 to 85C Test Conditions
VCC Min Typ Max Min Max Unit 2.0 -- -- 4 -- 3 MHz 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 -- -- -- -- -- -- -- -- -- -- -- -- -- 80 16 14 100 20 17 15 10 5 -- -- 36 -- 30 8 7 -- 35 -- -- 18 -- -- -- -- -- -- -- -- -- -- 5 48 20 24 75 15 13 300 60 53 150 30 25 -- -- -- -- -- -- -- -- -- 10 -- -- -- -- -- -- -- -- -- -- -- -- 100 20 17 125 25 21 15 10 5 -- -- 16 19 95 19 16 380 75 65 185 38 32 -- -- -- -- -- -- -- -- -- 10 -- pF pF ns ns ns
Propagation delay time
CLK or CLK to Q
PR or CLR to Q
th
ns
1. CPD is equivalent capacitance inside of the IC calculated from the operating current without load (see test circuit). The average operating current without load is calculated according to the expression below. ICC (opr) = CPD * VCC * fIN + ICC
Rev.2.00, Jul.16.2004, page 5 of 13
HD151012 Test Circuit
VCC Input Pulse generator
See Function Table
VCC
J0 J1 Output Q
Zout = 50 Input Pulse generator Zout = 50
J7 CLK CLK SPE PR CLR CL
Note:
1. CL includes probe and jig capacitance.
Waveforms - 1
tw 6 ns tw 6 ns 90 % 90 % 50 % 50 % 10 % t PLH 90 % t PHL 90 % 50 % 10 % t THL
CLK
VCC
CLK
10 %
GND
VOH
Q
10 %
50 % t TLH
VOL
Rev.2.00, Jul.16.2004, page 6 of 13
HD151012 Waveforms - 2
6 ns 90 % 90 % 50 % 10 % 10 % ts
VCC
Jn
GND
90 % 50 %
CLK
VCC
CLK
10 %
10 % 6 ns
GND VOH
50 %
F/F Output
*1
Internal delay
VOL
Waveforms - 3
6 ns 90 % 90 % 50 % 10 % th 10 %
VCC
Jn
GND VCC
CLK
50 %
90 %
CLK
10 %
10 % 6 ns
GND VOH
50 %
F/F Output
*1
Internal delay
VOL
Note:
1. F/F output is internal signal of IC.
Rev.2.00, Jul.16.2004, page 7 of 13
HD151012 Waveforms - 4
6 ns 90 % 90 % 50 % 10 % 10 % ts
VCC
SPE
GND
90 % 50 %
CLK
VCC
CLK
10 %
10 % 6 ns
GND VOH
50 %
F/F Output
*1
Internal delay
VOL
Waveforms - 5
6 ns 90 % 90 % 50 % 10 % th 10 %
VCC
SPE
GND VCC
CLK
50 %
90 %
CLK
10 %
10 % 6 ns
GND VOH
F/F Output
*1
50 %
Internal delay
VOL
Note:
1. F/F output is internal signal of IC.
Rev.2.00, Jul.16.2004, page 8 of 13
HD151012 Waveforms - 6
tf 90 % tr 90 % 50 % 10 % tw tf 90 % tr 90 % 50 % 10 % tw t PHL t PLH
VCC
CLR
50 % 10 %
GND
VCC
PR
50 % 10 %
GND
VOH Q
50 % 50 %
VOL
Rev.2.00, Jul.16.2004, page 9 of 13
HD151012
Timing Chart
CLK
SPE
J0
J1
J2
J3
J4
J5
J6
J7
(CO=SPE)
CLR (Initialize of CLR) Q
PR (Initialize of PR) Q
Count
5
4
3
2
1
0
3
2
1
0
35
34
Rev.2.00, Jul.16.2004, page 10 of 13
HD151012
Example of Application Circuit
AC Signal Generator for STN Type Liquid Crystal Panel Initialize counter: 50
J0 J1 J2 J3 J4 J5 J6 GND V CC CLK CLK Q PR SPE CLR J7 * *
Note:
When initializing output D-F/F apply "L"
Rev.2.00, Jul.16.2004, page 11 of 13
HD151012
Timing Chart
Example of AC Signal Generator
1 2 3 49 50 51 52 53 101 102 103 104
CLK
SPE J0
J1
J2
J3 50 J4
J5
J6
J7
(CO=SPE)
CLR
Q
PR
Q
Count
50
49
48
2
1
0
50
49
1
0
50
49
Rev.2.00, Jul.16.2004, page 12 of 13
HD151012
Package Dimensions
As of January, 2003
Unit: mm
5.00 5.30 Max 16 9
4.40
1
*0.20 0.05
8 0.65 0.13 M 0.65 Max
*0.15 0.05
1.0 6.40 0.20 0 - 8 0.50 0.10
1.10 Max
0.10
0.07 +0.03 -0.04
*Ni/Pd/Au plating
Package Code JEDEC JEITA Mass (reference value)
TTP-16DAV -- -- 0.05 g
Rev.2.00, Jul.16.2004, page 13 of 13
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
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http://www.renesas.com
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